Submount of P&L SEMI CO., LTD

Product

Submount
  • Submount
Overview
Parts functioning heat dissipation of high power semiconductor devices and optics of optical semiconductor devices

Substrate Materials
Si , AlN, SiC, BeO, AIC

Metallization
Ti/Pt/Au/AuSn , Au, Ti/Ni/Au/AuSn

Design
Cus...

Description of the Product

Overview
Parts functioning heat dissipation of high power semiconductor devices and optics of optical semiconductor devices

Substrate Materials
Si , AlN, SiC, BeO, AIC

Metallization
Ti/Pt/Au/AuSn , Au, Ti/Ni/Au/AuSn

Design
Customize

Application
· Laser Diode Heat sink Package
· High Power LED Heat sink Package
· Power Divice Heat Sink Parts
· Optical Divice Parts & Package

Price of the Product

Price not indicated

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